View probe locations, cycle,
energy deposited and rise/fall times for each sensor
thermal flow, rise times, energy delivered to any set of feature profile
Create movie sequences of
Single or multi-window
photogallery of temperature, rise-times, thermal flow, energy etc.
Response at each probe point
can be evaluated to determine it's variance with respect to other points
on the wafer.
- Any film or feature
- CD-sem metrology,
overlay, scatterometry, Ellipsometry
- Process simulator
- Thermal-sensor data
from any data source
- Microsoft Excel TM
Spreadsheets and workbooks
- Open system; access to
all raw, calculated and modeled data.
- Thermal process
optimization and characterization
- Process development
- Simulation variable
validation and calculation
- Simulation results
Dimensional spreads across
the wafer during each lithographic imaging step are most strongly
controlled by the speed and uniformity of the post-exposure bake (PEB).
During the PEB a thermal dose is delivered to latent acid image of the
exposure to drive the deblocking reaction that changes the solubility of
the resist in the develop step.
Device critical geometries
are rapidly approaching 40 nanometer (nm) node with tolerances of about
2 nm, 3 sigma variation about the feature size. Since the sensitivity of
deep ultraviolet (DUV) resists to temperature variation during the PEB
range around 3 nm/oC, it is critically important that uniformity of the
bake cycle be closely characterized, controlled and monitored during
LithoWorks PEB™ provides tools to characterize, model and control the
uniformity of critical feature dimensional variation arising from the
PEB process step. LithoWorks PEB is capable of gathering data from any
thermal mapping product including the OnWafer and SensArray temperature
monitors. Critical dimension (CD) data are gathered from measurements
taken by many commercial sources including CD-SEM's, Scatterometry,
Ellipsometric and Electrical Linewidth Measurement (ELM) tools. Thermal
and CD data are then convolved using models and SLS proprietary analyses
to characterize the PEB cycle and set it's control variables to minimize
variations across the wafer.
LithoWorks PEB© is used to
minimize process variation of critical dimensions within the process
window. The LithoWorks suite provides an open system of access and
versatility for the process engineer. Any form of metrology data can be
easily imported. Data, analyses are results are all conveniently stored
in Microsoft Excel© workbooks for easy access and customization.
Analyses are conducted using the unique object-oriented lot models and
interactive graphics of SLS Inc.
Software Requirement Specification for more details.
- Automatically converts
any data into Excel Spreadsheets.
- Adaptive models, raw
data and residual spatial analysis interface.
- Analyze the entire bake
cycle including Temperature, rise/fall times, variation mapping,
time-at-temperature, integrated energy and integrated energy
variation across the plate.
- Model wafer dependant
variations of films and feature profiles.
- Automated orientation
calculation for BakePlate-to-Exposure-Tool alignment.
- Automated exposure
layout and tool configuration with the Weir layout interface.
- Exposure tool library
for storage of tool characteristics.
structure with point-and-click graphics and culling.
- Advanced graphics
includ histograms, vector, range, XYplot , BoxPlots, Population
Density, contour, bulls-eye and 3D plotting.
- Easy sub-set data
selection; automated and manual Data culling ... automated by wafer,
field, site, range, NA, PC (Sigma) and manual mouse-selection.
- Full wafer models with
coefficient removal and simulator for “What If?” scenario
- Thermal variable to
film/feature distribution correlation and covariance matrices.
LithoWorks PEB is a compiled
application with a full object oriented, mouse-interactive interface.
Drill down graphics and spreadsheet analysis supported. Functional on
Windows NT and Windows 2000, XP etc. Microsoft Excel is required.
- Pentium IV, 2.0 GHz,
- 512 Meg of RAM,
- 1024x768 Graphic
- 30 M free space on disk
- Data storage may
require up to 2.0 Gigabytes additional.