Providing the analysis tools and expertise that semiconductor manufacturers need to manage their toolsets, process, lithography, device yield and productivity. TEA Systems products accelerate yield learning through the effortless application of raw data analysis and sophisticated modeling of any metrology data. Proprietary analysis methods convert meaningless random variations into controllable systematic process signatures and yield-loss analyses.
Process, Lot, Film, Wafer, Field, Slit, Scan and Profile modeled analysis.
Process Window: full-field, multi-site, full-profile, multi-feature
Point-and-click analysis macro's for interactive or computer automation.
Advanced Process Control modeling engines for any APC / metrology system
Focus derivation and modeled perturbation analysis from Bossung plots or proprietary features.
Modeled lot gating.
Advanced process, equipment and metrology tool setup & control
Reticle Enhancement Technology (RET), Optical Proximity (OPC), Phase Shift reticle qualification and validation from direct or process derived data.
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