Tutorials - Process Window

Tutorials - Process Window

Weir PW Feature Response & Spatial Studies	Application
Analysis of wafer-chuck influence on features	Exposure Tool Control
CD variation with Focus perturbations	Process Setup
CD-sem correlation to Optical Scatterometry	Metrology Tool
Ellipsometer - exposure sensitivity study	Metrology Tool
Exposure variation effects on features	Process Setup
Feature response to focus perturbations (Ellipsometer)	Process Setup
Hot-plate comparison - CD response	Process Tuning
Reticle error detection and "bad" data removal	Process Control
Reticle dimension to wafer feature correlation	Process Setup
Reticle & Wafer, field signature matching	Process Control
Scanner Row & Column modeling for slit & scan control	Exposure Tool Control
Modeling wafer tilt separate from field tilt (SPIE 2003 paper)	Exposure Tool Control
Measuring dense feature profiles with optical scatterometry	Process Control
Measuring isolated feature profiles with optical scatterometry	Metrology Tool

Process Window Studies Weir PW & LithoWorks PW	Application
Process window Duty-cycle response for 100 nm features	Duty cycle & Exposure Tool
1:1 Duty Cycle process window response to across-field aberrations	Exposure tool and process window
Studying FEM process windows from optical scatter	Process window methods
Full-field "Best Focus", optimum CD and Depth-of-Focus contours	Process window & exposure tool