Semiconductor data modeling for tool, process and yield




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TEA Systems offers on-site classes that address advanced modeling techniques used in the industry for calibration, characterization and process control.

Exposure Tool APC methods and calibration using control models


How ready are you as a Lithographer to meet the challenges of a technology confronted by increased technical challenges and dwindling operational margins? Optical Lithography will carry the industry through the first decade of the new millennium. New tools such as variable Numeric Aperture, Partial Coherence, Active Lens Stacks and individual control of scan, platen, chuck and optics tilt will allow the engineer to fine tune stepper and scanner performance as never before. Yet, these new tools also contribute unexpected interactions in the Focus Budget, Aberrations and Distortions present in lithography.

Real time control of the production margin is best managed by a combination of experience-based models and performance simulation from sparse data metrology. But what criteria are best employed in these environments and how can the engineer control production without control-loop runaway?

The next decade will require the lithographer to clearly understand key areas:

  • Equipment setup, tuning, calibration and matching.
  • Lens distortions that influence optical train performance and multiple tool matching.
  • Focal plane aberrations and their influence on critical dimension control.
  • The influence of the process and reticle tool-set on aberration and production control.
  • This course addresses advanced techniques for lithography equipment characterization, optimization and matching. Through theory, statistics and real data examples we will consider when to apply each as well as the advantages and potential pitfalls of the each technique.

    Afterwards you will be able to:

  • Define and design advanced process control algorithms for the needs of production.
  • Describe the similarities and differences of machine tuning, control and matching.
  • Define optimum machine models for your equipment set and identify the tuning critical components.
  • Classify potential error sources in terms of tunable machine subassembly algorithms.
  • Compute the contribution of site dependent, sub-system and metrology distortion components in your equipment set.
  • Compose a library of machine models for your custom process and formulate a comprehensive matching program optimized to manufacture or tool maintenance.
  • Quantitatively compare system performance between steppers and other lithographic technologies for control, tuning and matching.
  • Define the influence of various aberration classes on overlay, depth of focus and Critical Dimension performance.
  • Design optimum model, data and equipment validation techniques for production control parameters.
  • Who should Attend?

  • This course is intended for experienced engineers in lithography, process, tool characterization and control. Attendees should possess a good understanding of Optics and Lithography.

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